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    Home » China’s Hidden Chip Win: The Wafer Size That’s Changing the Game
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    China’s Hidden Chip Win: The Wafer Size That’s Changing the Game

    Lina Johnson MercilliBy Lina Johnson MercilliAugust 9, 2026No Comments2 Mins Read
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    Quick Takeaways

    1. Hwatsing introduced China’s first integrated six-inch wafer metrology system for CMP.
    2. The system improves wafer flattening measurement, boosting efficiency and reducing waste.
    3. The tool targets mature semiconductor nodes, complementing China’s growing chip industry.
    4. China’s CMP market share rose to nearly 11%, aiming for self-sufficiency amid US export restrictions.

    China’s New Milestone in Chip Manufacturing

    China recently made a significant step in chipmaking. Hwatsing Technology announced a new metrology system for six-inch wafers. This system can be built directly into the polishing process. It measures wafers before and after polishing and provides real-time data to the control system. This integration helps improve wafer quality and reduce waste. The development reflects China’s focus on strengthening its semiconductor industry.

    Despite most advanced chips being made on 300mm wafers, China still uses smaller wafers like the 150mm, which are common for mature nodes and certain semiconductors. Larger wafers, such as 200mm and 300mm, are essential for cutting-edge technology. Still, China’s advances in smaller wafer processing show progress toward more advanced manufacturing. Hwatsing’s growth indicates China’s shift from dependence to capability in equipment manufacturing. The company shipped its 1,000th CMP system in April and is investing heavily to expand capacity and develop high-end tools.

    What This Means for China and the Global Tech Market

    China aims to become more self-reliant in semiconductor equipment. It has increased its share of the global CMP equipment market from 1.5% in 2022 to nearly 11% in 2023. Hwatsing leads this growth. Still, major breakthroughs, like EUV lithography machines, remain out of reach. US-led export controls prevent Chinese companies from accessing these tools, which limits their ability to produce the most advanced chips.

    China focuses on closing smaller gaps in the supply chain. Its domestic efforts include developing immersion DUV lithography machines, but progress there is still uncertain. The country’s strategy aims to make every process step more independent, gradually reducing reliance on foreign technology. Companies like CXMT demonstrate China’s potential to build successful chip businesses. Demand for Chinese chips is rising, with companies like Apple testing CXMT’s memory products. Yet, dependency on foreign equipment persists. The progress made with tools like Hwatsing’s signals a steady move toward self-sufficiency, even if it takes time to match the world’s leading technology.

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    Lina Johnson Mercilli
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    Lina Johnson Marcelli is the editor for IO Tribune, bringing over two decades of experience in journalism to her role. With a BA in Journalism, she is passionate about delivering impactful stories that resonate with readers. Known for her keen editorial vision and leadership, Lina is dedicated to fostering innovative storytelling across the publication. Outside of work, she enjoys exploring new media trends and mentoring aspiring journalists.

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